[Update PCB]:File Update

This commit is contained in:
Brin 2025-03-21 17:25:14 +08:00
parent 5e13b9e385
commit 42a1c5c38a
5 changed files with 6844 additions and 1101 deletions

View File

@ -4,3 +4,4 @@
## 2025年3月5日 更新PCB图 正在布板 除WIFI模块以外布板完成
## 2025年3月6日 布板完成 走线中
## 2025年3月13日 走线中 RGB完成
## 2025年3月21日 地需要重新补一下

File diff suppressed because it is too large Load Diff

View File

@ -1,8 +1,8 @@
{
"board": {
"active_layer": 2,
"active_layer_preset": "All Layers",
"auto_track_width": true,
"active_layer": 0,
"active_layer_preset": "All Copper Layers",
"auto_track_width": false,
"hidden_netclasses": [],
"hidden_nets": [],
"high_contrast_mode": 0,
@ -49,7 +49,7 @@
"conflict_shadows",
"shapes"
],
"visible_layers": "ffffffff_ffffffff_ffffffff_ffffffff",
"visible_layers": "00000000_00000000_55555555_57555555",
"zone_display_mode": 0
},
"git": {
@ -88,16 +88,16 @@
9
],
"col_widths": [
164,
154,
97,
58,
97,
97,
97,
58,
97,
97
109,
103,
65,
39,
65,
65,
65,
39,
65,
65
],
"custom_group_rules": [],
"expanded_rows": [],

View File

@ -127,17 +127,17 @@
"min_connection": 0.0,
"min_copper_edge_clearance": 0.5,
"min_groove_width": 0.0,
"min_hole_clearance": 0.25,
"min_hole_clearance": 0.15,
"min_hole_to_hole": 0.25,
"min_microvia_diameter": 0.55,
"min_microvia_drill": 0.3,
"min_microvia_drill": 0.1,
"min_resolved_spokes": 2,
"min_silk_clearance": 0.0,
"min_text_height": 0.8,
"min_text_thickness": 0.08,
"min_through_hole_diameter": 0.3,
"min_track_width": 0.0,
"min_via_annular_width": 0.3,
"min_via_annular_width": 0.1,
"min_via_diameter": 0.5,
"solder_mask_to_copper_clearance": 0.0,
"use_height_for_length_calcs": false